18.5.1.C Is the compliant pin assembly personnel trained for the task being performed and are training records available and up to date? YES/NO

18.5.2.C Is the tool defined in the procedure being used? YES/NO

18.5.3.C Are the assemblies inspected for compliant pin insertion compliance in accordance with the requirements? YES/NO/N/A

18.5.4.C Does the supplier control the press to prevent compressive damage to the assembly and ensure compliance? YES/NO/N/A

18.5.5.C If there is rework performed, is it done according to the procedure? YES/NO/N/A

19 CLEANLINESS N/A

19.1.P Are there procedures that define:

a.P - Method to control cleanliness level, if final clean is not required? YES/NO/N/A

b.P - Arrangement / placement in the machine of Circuit Card Assemblies? YES/NO

c.P - Cleaning of non-hermetic components? YES/NO

d.P - Temporary fixtures? YES/NO

e.P - Control of dryness? YES/NO

f.P - Selection and use of machine / manual processes? YES/NO

g.P - Configuration management of tools and jigs? YES/NO/N/A

h.P - Prevention of contamination or damage after cleaning (clean containers and racks, continuous flow)? YES/NO

i.P - A method of monitoring concentration of cleaning solution, if saponifier is used?

YES/NO/N/A

j.P - Prevention of cross contamination of cleaning chemistries? YES/NO

k.P - Method, frequency, and recording of variable data related to the verification of cleanliness to be less than 1.56 microgram/cm2 (10 microgram/in2 ) of NaCl or customer specification? YES/NO

l.P - Maximum time between soldering and cleaning? YES/NO

Audit Note: Maximum allowed time of 8 hours unless otherwise specified by customer or manufacturer’s recommendation.

m.P - Setup, operation and maintenance of cleaning equipment? YES/NO

n.P - A method of monitoring the resistivity / conductivity of final rinsing solution if required by the Customer? YES/NO/N/A

CLEANLINESS COMPLIANCE

19.1.C Are assemblies being arranged / placed in the machine per the procedure? YES/NO

19.2.C If final clean is not required, is the cleanliness of assemblies controlled as specified in procedure? YES/NO/N/A

19.3.C If components are identified as incompatible with cleaning process, are they protected during cleaning? YES/NO/N/A

19.4.C If temporary fixtures are required, are they used? YES/NO/N/A

19.5.C Are dryness controls specified in the procedure being applied per customer requirements?

YES/NO

19.6.C If specified to be used, are all tools and jigs under configuration control? YES/NO/N/A

19.7.C If the cleaning chemistry has defined upper and lower concentration levels are they being monitored and controlled as per the procedure? YES/N/ N/A

19.8.C Are controls in place to prevent cross contamination of cleaning chemistries according to