4 GENERAL

No additional requirements

5 HOLE FILLING MATERIAL CONTROL N/A

5.1 Conductive Hole Fill Material for Blind and Buried Vias N/A

5.1.1.P Does a method exist for material selection in accordance with Customer requirement? YES/NO

Conductive Hole Fill Material for Blind and Buried Vias COMPLIANCE

5.1.1.C Is there objective evidence that the method for material selection in accordance with Customer requirement is being followed? YES/NO

5.2 Non conductive Hole Fill Material for Blind and Buried Vias N/A

5.2.1.P Does a method exist for material selection in accordance with Customer requirement? YES/NO

Compliance Assessment Guidance: Non conductive includes resin (e.g. for thermo-mechanical function/property), etc.

Non conductive Hole Fill Material for Blind and Buried Vias COMPLIANCE

5.2.1.C Is there objective evidence that the method for material selection in accordance with Customer requirement is being followed? YES/NO

6 INNER LAYERS REGISTRATION N/A

6.1.P Is there a procedure to control the registration of the buried vias layers for all lamination steps? YES/NO

Compliance Assessment Guidance: Can be performed by imaging process, laser ablation, microsection (in process as well as final) AOI, XRay or post etch punch; scaling must be adapted for copper clearance and dielectric drilling in case of 2 steps process.

INNER LAYERS REGISTRATION COMPLIANCE

6.1.C Is there objective evidence that the procedure to control the registration of the buried vias layers for all lamination steps is being followed? YES/NO

7 MATERIAL LAMINATION N/A

7.1.P Are there controlled conditions for the prevention and detection of

contamination in the lamination process? YES/NO

Compliance Assessment Guidance: Specific due to the higher risk led by high density and integration levels of the layers, process required to control/minimize contamination; lamination process = stack-up.

7.2.P Is there a procedure which defines and requires measurements of dielectric thickness in microvias layers? YES/NO

MATERIAL LAMINATION COMPLIANCE

7.1.C Is there objective evidence that controled conditions for the prevention and detection of contamination in the lamination process are being followed? YES/NO

7.2.C Is there a check of dielectric thickness in microvias layers using microsectional analysis? YES/NO