12 PLATING N/A
12.1 General
12.1.1.P If the line is vertical, is there a procedure for maintaining racks? YES/NO/N/A
12.1.2.P If it is not already part of an automated system, is there a procedure for calibrating the rectifiers and checking the ripple of the rectifiers? YES/NO/N/A
12.1.3.P Is there a procedure for maintaining chemistries according to manufacturer’s
specifications? YES/NO
12.1.4.P If the line is vertical, is there a procedure that defines a method to minimize bubble entrapment? YES/NO/N/A
General COMPLIANCE
12.1.1.C If no software controlled system exists, are the rectifiers calibrated and checked for ripple? YES/NO/N/A
12.1.2.C Is there maintenance of the racks in accordance with the procedure? YES/NO
12.1.3.C If not part of an automated system, is the procedure for maintaining chemistries according to manufacturer’s specifications being followed? YES/NO/N/A
12.1.4.C If required, is the procedure that defines a method to minimize bubble entrapment being followed? YES/NO/N/A
Either Electroless Copper OR Direct Metallization can be marked N/A, but not both sections. One or both of these processes must be performed at ALL plating facilities. Any questions within sections marked “N/A” are also N/A.
12.2 Electroless Copper N/A
12.2.1.P Is there a procedure for electroless copper plating? YES/NO
12.2.2.P Is there a procedure which defines the frequency for the monitoring and maintaining of the electroless copper chemistry within the plating bath? YES/NO
12.2.3.P Is there a procedure or system in place to eliminate bubble entrapment in the hole? YES/NO
12.2.4.P Is there a system in place to verify that the electroless copper coverage requirements have been met? YES/NO
Electroless Copper COMPLIANCE
12.2.1.C Is the procedure for electroless copper plating being followed? YES/NO
12.2.2.C Is the electroless copper plating bath being monitored and maintained per the procedure to maintain the chemistry within the defined limits? YES/NO
12.2.3.C Is there objective evidence that the electroless copper coverage requirement has been met? YES/NO
12.2.4.C Is there a system in place during the process, such as an agitation system, vibration or ultrasonics, to prevent bubble entrapment in the hole? YES/NO
12.3 Direct Metallization N/A
12.3.1.P Is there a procedure for direct metallization including the maximum waiting time between direct metallization (black hole) and copper plating? YES/NO
12.3.2.P
Is there a procedure that assures that coating has reached cure for coating material? YES/NO
12.3.3.P Is there a procedure for controlling the viscosity of the material? YES/NO
12.3.4.P If allowed by Customer, is there a procedure for Shadow Technology? YES/NO/N/A
Direct Metallization COMPLIANCE
12.3.1.C Is the procedure for direct metallization being followed? YES/NO
12.3.2.C Is the direct metallization solution being monitored and maintained per the procedure to maintain the chemistry within the defined limits? YES/NO
12.3.3.C Is the viscosity of the material controlled according to the procedure? YES/NO
12.3.4.C Are there temperature controls at the drying cycle set in accordance with the defined parameters per the procedure? YES/NO
12.3.5.C If allowed by the Customer, is the procedure for Shadow Technology being followed?
YES/NO/N/A
12.4 Electroplated Copper N/A
12.4.1.P Is there a procedure which defines the system to verify electroplated copper thickness and uniformity? YES/NO
12.4.2.P Is there a procedure for copper plating? YES/NO
12.4.3.P Is there a procedure to minimize oxide build-up on the cathode and anode bars? YES/NO
12.4.4.P Is there an established test frequency for ensuring that tensile and elongation properties are within specifications? YES/NO
12.4.5.P Is there a procedure to limit organic buildup? YES/NO
12.4.6.P Is there a procedure which defines the frequency for the monitoring and maintaining of the electroplated copper chemistry? YES/NO
Electroplated Copper COMPLIANCE
12.4.1.C Is the verification of plating thickness and uniformity performed? YES/NO
12.4.2.C If required, are cathode and anode bars maintained per procedure? YES/NO/N/A
12.4.3.C If used, are the anode bags kept above the solution level? YES/NO/N/A
12.4.4.C Is there objective evidence that plating bath integrity is maintained? YES/NO
12.4.5.C Is there an established test frequency for ensuring tensile and elongation properties are within specifications? YES/NO
12.4.6.C Are the cable contact points maintained per procedure? YES/NO
12.4.7.C Is there mechanical or fluid agitation? YES/NO
12.4.8.C Is the plating bath being monitored and controlled per the procedure to maintain the chemistry within the defined limits? YES/NO
12.4.9.C Are the chemical records maintained on analysis and additions? YES/NO
12.4.10.C Are brighteners and carriers maintained at manufacturer’s recommendations? YES/NO
12.4.11.C Is the process for copper plate being monitored and controlled for temperature per manufacturer’s specifications? YES/NO
12.4.12.C Is the copper plating bath monitored for levels of organic contamination using hull cell analysis, Cyclic Voltemmetric Stripping (CVS) Analysis, or spectrographic analysis? YES/NO
12.5 Pulse Reverse Plating N/A
12.5.1.P Is there a procedure which defines the system to verify electroplated copper thickness
and uniformity? YES/NO
12.5.2.P Is there a procedure for pulse reverse plating including cycle time? YES/NO
12.5.3.P Is there a procedure to limit organic buildup? YES/NO
12.5.4.P Is there a procedure which defines the frequency for the monitoring and maintaining the electroplated copper chemistry within the plating bath? YES/NO
12.5.5.P Is there a procedure to minimize oxide build-up on the cathode and anode bars? YES/NO
12.5.6.P Is there an established test frequency for ensuring tensile and elongation properties are within specifications? YES/NO
Pulse Reverse Plating COMPLIANCE
12.5.1.C Is the procedure for pulse-reverse plating being followed? YES/NO
12.5.2.C Is the procedure to limit organic buildup being followed? YES/NO
12.5.3.C Are the chemical records maintained on analysis and additions? YES/NO
12.5.4.C Are the Anode and Cathode bars being maintained as the procedure including their maintenance to minimize oxide build-up? YES/NO
12.5.5.C Is there an established test frequency for ensuring tensile and elongation properties are within specifications? YES/NO
12.5.6.C Is the verification of plating thickness performed? YES/NO
12.5.7.C If anode bags are used, are they kept above the solution level? YES/NO/N/A
12.5.8.C Are the cable contact points maintained per procedure? YES/NO
12.5.9.C Is there mechanical or fluid agitation? YES/NO
12.5.10.C Is the pulse-reverse plating solution being monitored and maintained as per the procedure to maintain the chemistry within the defined limits? YES/NO
12.5.11.C Are brighteners and carriers maintained at manufacturer’s recommendations? YES/NO
12.5.12.C Is the process for copper plate being monitored and controlled for temperature per manufacturer’s specifications? YES/NO
12.5.13.C
Is the copper plating bath monitored for levels of organic contamination using hull cell analysis, Cyclic Voltemmetric Stripping (CVS) Analysis, or spectrographic analysis? YES/NO