17.1.15.C Is the cleaning method being used as per the procedure and is the maximum time permitted between reflow and cleaning being observed? YES/NO
Audit Note: Maximum allowed time of 8 hours unless otherwise specified by customer or manufacturer’s recommendation.
17.2 Wave Soldering N/A
17.2.1.P Are there procedures that define:
a.P - Moisture control and/or baking for PB/CCA? YES/NO
b.P - Moisture control for sensitive components based on J-STD-033 and/or JSTD-020, unless otherwise specified by customer, if used during wave soldering? YES/NO/N/A
c.P - Flux density measurement of non-water based fluxes, if the density is adjusted? YES/NO/N/A
d.P - Shelf life control of flux? YES/NO
e.P - Curing time (if needed) and removal of temporary mask materials, if used? YES/NO/N/A
f.P - Method of initial program validation, validation of revisions including authorization rules?
YES/NO
g.P - Monitoring of controlled atmosphere, if used? YES/NO/N/A
h.P - Maintenance of air knife nozzles, if used? YES/NO/N/A
i.P - Setup of equipment, programs and tools including temperatures, speeds, etc.? YES/NO
j.P - Profile traceability? YES/NO
k.P - Control and record of solder bath/pot purity (maximum contaminants compliant to J-STD-001)? YES/NO
l.P - Inspection plan? YES/NO
m.P - Method of preventing cross contamination of solder alloys and fluxes, if more than one is used? YES/NO/N/A
n.P - Cleaning method and maximum time permitted between wave and clean for each flux chemistry used? YES/NO
Audit Note: Maximum allowed time of 8 hours unless otherwise specified by customer or manufacturer’s recommendation.
Wave Soldering COMPLIANCE
17.2.1.C Are the PB / CCA being controlled to minimize moisture ingress in accordance with the procedure? YES/NO
17.2.2.C If used, are moisture sensitive components handled in accordance with the procedure?
YES/NO/N/A
17.2.3.C Is the qualified flux and solder alloy being used for the part number being soldered?
YES/NO
17.2.4.C If different solder alloys and fluxes are in use, is cross contamination between different solder alloys and different fluxes prevented? YES/NO/N/A
17.2.5.C Is the flux shelf life being controlled according to the manufacturer’s specification?
YES/NO
17.2.6.C If used, is there evidence that the application, curing and removal of temporary mask, is carried out according to the procedure? YES/NO/N/A
17.2.7.C If adjusted, is the density of non-water based fluxes being controlled as per procedure and manufacturers recommendations? YES/NO/N/A
17.2.8.C Is set-up of equipment being carried out according to the procedure? YES/NO
17.2.9.C Is the profile in use being monitored according to the procedure to assure compliance to the defined requirements for temperature and time parameters? YES/NO
17.2.10.C Is there evidence that the preventive maintenance is complete, including thermocouple calibration, periodic cleaning of equipment and tools and if used air knife nozzle? YES/NO
17.2.11.C Is the control of solder bath / pot purity monitored in accordance with the procedure?
YES/NO
17.2.12.C Are all drawings, machine programs, written instructions, product specific fixtures under configuration control and do they match the assembly traveler? YES/NO
17.2.13.C Is there evidence of program validation and approval per procedure? YES/NO
17.2.14.C Is there evidence that the method of program revision is followed? YES/NO
17.2.15.C Are the work instructions including the sequence of operation being followed? YES/NO
17.2.16.C Is there evidence the inspection plan is being followed? YES/NO
17.2.17.C Are soldering defects including solder joint touchup identified, recorded and addressed in a continuous improvement plan? YES/NO
17.2.18.C If controlled atmosphere is used, is the procedure for monitoring being followed? YES/NO/N/A
17.2.19.C Is the cleaning method being used as per the procedure and is the maximum time permitted between wave soldering and cleaning being observed? YES/NO
Audit Note: Maximum allowed time of 8 hours unless otherwise specified by customer or manufacturer’s recommendation.