5 INNER LAYERS N/A

5.1 Inner Layer Inspection N/A

5.1.1.P Does automated optical inspection (AOI) capability exist within facility? YES NO

Inner Layer Inspection COMPLIANCE

5.1.1.C Is Automated Optical Inspection (AOI) used to verify that the established

parameters have been met to show process control? YES/NO

6 FINAL FINISHES N/A

6.1 Selective Solder Strip/Plate N/A

6.1.1.P Is there a documented procedure for controlling selective solder strip/plate? YES/NO

Selective Solder Strip/Plate COMPLIANCE

6.1.1.C Is the selective solder strip/plate being controlled as specified in the documented

procedure? YES/NO

6.1.2.C Is copper reduction controlled? YES/NO

7 ROUTING N/A

7.1.P If depth routing is performed, is there a procedure for controlled depth routing? YES/NO/N/A

7.2.P Is there a procedure for the countersink and counterbore process? YES/NO

7.3.P If chamfering is used, is there a procedure for the chamfering process? YES/NO/N/A

7.4.P If the V-groove process is performed, is there a procedure for the V-groove process? YES/NO/N/A

ROUTING COMPLIANCE

7.1.C Is there an inspection of the board for countersink depth/diameter? YES/NO

7.2.C Is there an inspection of the board for counterbore depth/diameter? YES/NO

7.3.C If chamfering is used, is there an inspection of the board for chamfer requirements? YES/NO/N/A

7.4.C If the V-groove process is used, is there an inspection of the board for V-groove depth?

YES/NO/N/A

8 FINAL VALIDATION N/A

8.1 Is there objective evidence of compliance with testing Requirements (Acceptance Testing and Frequency Matrix, Table 4-3 of IPC-6012)? YES/NO

8.2 Are the test results for soldermask adhesion recorded? YES/NO

8.3 Is there objective evidence of test results (Acceptance Testing and Frequency Matrix, Table 4-3 of IPC-6012)? YES/NO